[ALICE 3] TF3: update OTOF geometry with split staves - #15666

• Each stave in the OTOF is now subdivided into 2 sub-staves overlapping in the local X direction (half staves along longitudinal axis not yet implemented). The stave geometry is derived from the available IOTOF CAD presented at the last upgrade week and TB (see these slides)
• The envelope volumes (layer, stave, substave) have been updated to match the updated layout
• The sensor (default: 50 um thickness) has been moved to the top edge of the chip.
• The chip dimensions in X and Z are now matched between inner and outer TOF, so a single set of segmentation parameters is now used.

The following checks have been carried out:

• Geometric overlaps: no overlaps are found, both with the deterministic and MC method
• The full simulation/digitization chain has been applied and the results match expectations

Spatial distribution of digits in the updated layout

Updated OTOF layout

Close up of the updated module layout with the sensitive volume in the top part of the chip

Close up of the geometry showcasing the updated OTOF volume hierarchy